Incoming quality control
Every reel of components and every batch of bare PCBs is verified against the approved vendor list. Moisture-sensitive parts are logged, baked when required and stored in dry cabinets before they reach the line.
Solder paste and 3D SPI
Most soldering defects start at the printer. After stencil printing, 3D solder paste inspection measures the volume, height and offset of every deposit and stops the line automatically if a trend drifts out of tolerance.
Placement and reflow
Our four SMT lines place components down to 01005 size and fine-pitch BGAs. Nitrogen reflow ovens follow a profile validated for each board, and thermocouple profiling is repeated at every product change-over.
AOI, X-ray and ICT
Automated optical inspection checks polarity, presence and solder fillets. Hidden BGA joints are verified by X-ray, and in-circuit and flying-probe testers confirm the electrical integrity of every net before the board moves to box build.
